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 Green Product
STU411D
Ver 1.0
S a mHop Microelectronics C orp.
Dual Enhancement Mode Field Effect Transistor (N and P Channel)
PRODUCT SUMMARY (N-Channel)
VDSS
40V
PRODUCT SUMMARY (P-Channel)
VDSS
-40V
ID
15A
RDS(ON) (m) Max
32 @ VGS=10V
ID
-12A
RDS(ON) (m) Max
48 @ VGS=-10V 68 @ VGS=-4.5V
42 @ VGS=4.5V
D1/D2
G1
D1
D2
G2
S1
G1 S2 G2 TO-252-4L
S1
N-ch
S2
P -ch
ABSOLUTE MAXIMUM RATINGS ( T C=25 C unless otherwise noted ) Symbol VDS VGS ID IDM EAS PD TJ, TSTG Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous -Pulsed
b d a
TC=25C TC=70C
N-Channel P-Channel 40 -40 20 20 15 -12 12 43 8 -10 -36 15 11 6.7 -55 to 150
Units V V A A A mJ W W C
Sigle Pulse Avalanche Energy Maximum Power Dissipation
a
TC=25C TC=70C
Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS a R JC Thermal Resistance, Junction-to-Case R JA Thermal Resistance, Junction-to-Ambient
a
12 60
C/W C/W
Details are subject to change without notice.
Sep,04,2008
1
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STU411D
Ver 1.0
N-Channel ELECTRICAL CHARACTERISTICS ( TC=25 C unless otherwise noted )
4 Symbol
Parameter
Conditions
VGS=0V , ID=250uA VDS=32V , VGS=0V
Min 40
Typ
Max
Units V uA uA
OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS IGSS Gate-Body Leakage Current
VGS= 20V , VDS=0V
1 10
ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) gFS Drain-Source On-State Resistance Forward Transconductance
c
VDS=VGS , ID=250uA VGS=10V , ID=15A VGS=4.5V , ID=13A VDS=5V , ID=15A
1.25
1.5 25 32 17
3 32 42
V m ohm m ohm S
DYNAMIC CHARACTERISTICS Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge
c
VDS=20V,VGS=0V f=1.0MHz
623 95 56
pF pF pF ns ns ns ns nC nC nC nC 2.2
VDD=20V ID=1A VGS=10V RGEN=3.3 ohm VDS=20V,ID=15A,VGS=10V VDS=20V,ID=15A,VGS=4.5V VDS=20V,ID=15A, VGS=10V
10.5 10.6 39 9.6 9.5 4.5 1.6 2.3
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Maximum Continuous Drain-Source Diode Forward Current IS VSD Diode Forward Voltage
b
A V
VGS=0V,IS=2.2A
0.78
1.2
Sep,04,2008
2
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STU411D
Ver 1.0
P-Channel ELECTRICAL CHARACTERISTICS ( TC=25 C unless otherwise noted )
4 Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS IGSS Gate-Body Leakage Current
VGS=0V , ID=-250uA VDS=-32V , VGS=0V
-40 -1 10
V uA uA
VGS= 20V , VDS=0V
ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) gFS Drain-Source On-State Resistance Forward Transconductance
c
VDS=VGS , ID=-250uA VGS=-10V , ID=-12A VGS=-4.5V , ID=-10A VDS=-5V , ID=-12A
-1.25
-1.6 38 52 9
-3 48 68
V m ohm m ohm S
DYNAMIC CHARACTERISTICS CISS COSS CRSS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
c
VDS=-20V,VGS=0V f=1.0MHz
895 138 67
pF pF pF
SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD=-20V ID=-1A VGS=-10V RGEN=3 ohm VDS=-20V,ID=-12A,VGS=-10V VDS=-20V,ID=-12A,VGS=-4.5V VDS=-20V,ID=-12A, VGS=-10V
14 14 54 10 14.5 7 2.1 3.4
ns ns ns ns nC nC nC nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Maximum Continuous Drain-Source Diode Forward Current IS VSD Diode Forward Voltage
b
VGS=0V,IS=-2.0A
-0.77
-2.0 -1.2
A V
Notes
_ a.Surface Mounted on FR4 Board,t < 10sec. _ _ b.Pulse Test:Pulse Width < 300us, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing. d.Starting TJ=25C,L=0.5mH,VDD = 20V,VGS=10V.(See Figure13)
Sep,04,2008
3
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STU411D
Ver 1.0
N-Channel
40
V G S =10V V G S =4.5V V G S =4V
20
ID, Drain Current(A)
V G S =3.5V
24
ID, Drain Current(A)
32
16
12
T j =125 C
-55 C 8 4 0 25 C
16
V G S =3V
8 0
V G S =2.5V
0
0.5
1
1.5
2
2.5
3
0
0.8
1.6
2.4
3.2
4.0
4.8
VDS, Drain-to-Source Voltage(V)
VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
72
Figure 2. Transfer Characteristics
1.5
RDS(on), On-Resistance Normalized
60
1.4 1.3 1.2 1.1 1.0 0.0
V G S =4.5V ID=13A
RDS(on)(m )
48 V G S =4.5V 36 24 V G S =10V 12 0
V G S =10V ID=15A
1
8
16
24
32
40
0
25
50
75
100
125
150
T j ( C )
ID, Drain Current(A)
Tj, Junction Temperature( C )
Figure 3. On-Resistance vs. Drain Current and Gate Voltage
1.2
Figure 4. On-Resistance Variation with Drain Current and Temperature
BVDSS, Normalized Drain-Source Breakdown Voltage
1.15
Vth, Normalized Gate-Source Threshold Voltage
1.1 1.0 0.9 0.8 0.7 0.6 0.5 -50 -25 0 25 50 75
V DS =V G S ID=250uA
ID=250uA
1.10 1.05 1.00 0.95 0.90 0.85 -50
100 125 150
-25
0
25
50
75
100 125 150
Tj, Junction Temperature( C )
Tj, Junction Temperature( C )
Figure 5. Gate Threshold Variation with Temperature 4
Figure 6. Breakdown Voltage Variation with Temperature
Sep,04,2008
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STU411D
Ver 1.0
84 70
20.0
Is, Source-drain current(A)
ID=15A
10.0
RDS(on)(m )
56 125 C 42 28 75 C 14 0 25 C
5.0
125 C
75 C
25 C
0
2
4
6
8
10
1.0 0 0.4 0.8 1.2 1.6 2.0
VGS, Gate-to-Source Voltage(V)
VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs. Gate-Source Voltage
1200
Figure 8. Body Diode Forward Voltage Variation with Source Current
10
VGS, Gate to Source Voltage(V)
1000
C, Capacitance(pF)
8 6 4 2 0 0
VDS=20V ID=15A
800 Ciss 600 400 Coss 200 Crss 0 0 5 10 15 20 25 30
2
4
6
8
10
12
14 16
VDS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
1000
100
Li m it
10 1m 10 m DC s s 0u s 10
ID, Drain Current(A)
Switching Time(ns)
100
TD(off)
10
RD
S(
) ON
us
Tr
Tf
10
TD(on)
1
1 1
VDS=20V,ID=1A VGS=10V
3 10 60 100
0.1 0.1
V G S =10V S ingle P ulse T c=25 C
1 10 100
Rg, Gate Resistance()
VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Sep,04,2008
5
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STU411D
Ver 1.0
15V
V ( BR )D S S
tp
VDS
L
D R IVE R
RG
20V
D .U .T
IA S tp
+ - VD D
A
0.0 1
IAS
Unclamped Inductive Test Circuit F igure 13a.
Unclamped Inductive Waveforms F igure 13b.
2 1
D=0.5
Normalized Transient Thermal Resistance
0.2 0.1
0.1
0.05 0.02 0.01 S ING LE P ULS E
P DM t1 t2 1. 2. 3. 4. R J A (t)=r (t) * R J A R J A=S ee Datas heet T J M-T A = P DM* R J A (t) Duty C ycle, D=t1/t2
0.01 0.00001
0.0001
0.001
0.01
0.1
1
10
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Sep,04,2008
6
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STU411D
Ver 1.0
P-Channel
20
VGS=-10V
VGS=-4.5V
15
-ID, Drain Current(A)
-ID, Drain Current(A)
16
VGS=-3.5V
12
12
9 Tj=125 C 6 25 C 3 0 -55 C
8 4
VGS=-8V
VGS=-3V
0 0
0.5
1
1.5
2
2.5
3
0
0.8
1.6
2.4
3.2
4.0
4.8
-VDS, Drain-to-Source Voltage(V)
-VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
120 100
Figure 2. Transfer Characteristics
1.5 1.4 1.3 1.2 1.1 1.0 0.0
VGS=-4.5V ID=-10A VGS=-10V ID=-12A
RDS(on)(m )
80 60 40 VGS=-10V 20 0 VGS=-4.5V
1
4
8
12
16
20
RDS(on), On-Resistance Normalized
0
25
50
75
100
125
150 T j ( C )
-ID, Drain Current(A)
Tj, Junction Temperature( C )
Figure 3. On-Resistance vs. Drain Current and Gate Voltage
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150
Figure 4. On-Resistance Variation with Drain Current and Temperature
BVDSS, Normalized Drain-Source Breakdown Voltage
1.15
Vth, Normalized Gate-Source Threshold Voltage
VDS=VGS ID=-250uA
ID=-250uA
1.10 1.05 1.00 0.95 0.90 0.85 -50
-25
0
25
50
75
100 125 150
Tj, Junction Temperature( C )
Tj, Junction Temperature( C )
Figure 5. Gate Threshold Variation with Temperature 7
Figure 6. Breakdown Voltage Variation with Temperature
Sep,04,2008
www.samhop.com.tw
STU411D
Ver 1.0
120 100
20.0
-Is, Source-drain current(A)
ID=-12A
10.0
25 C
RDS(on)(m )
80 125 C 60 40 20 0 75 C 25 C
125 C
75 C
0
2
4
6
8
10
1.0 0.4
0.6
0.8
1.0
1.2
1.4
-VGS, Gate-to-Source Voltage(V)
-VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs. Gate-Source Voltage
1200 1000 Ciss
Figure 8. Body Diode Forward Voltage Variation with Source Current
10
-VGS, Gate to Source Voltage(V)
C, Capacitance(pF)
8
VDS=-20V ID=-12A
800 600 400 Coss 200 Crss 0 0 5 10 15 20 25 30
6
4 2 0 0 2 4 6 8 10 12 14 16
-VDS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
1000
100
it
10 1m 10 m DC s s 0u s
-ID, Drain Current(A)
Switching Time(ns)
100
TD(off )
10
R
DS
(
) ON
Li
m
Tr
TD(on)
10
Tf
1
1 1
VDS=-20V,ID=-1A VGS=-10V
0.1 6 10 60 100 0.1
V G S =-10V S ingle P ulse T c=25 C
1 10 100
Rg, Gate Resistance()
-VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Sep,04,2008
8
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STU411D
Ver 1.0
15V
V ( BR )D S S
tp
VDS
L
D R IVE R
RG
20V
D .U .T
IA S tp
+ - VD D
A
0.0 1
IAS
Unclamped Inductive Test Circuit F igure 13a.
Unclamped Inductive Waveforms F igure 13b.
2 1
D=0.5
Normalized Transient Thermal Resistance
0.2 0.1
0.1
0.05 0.02 0.01 S ING LE P ULS E
P DM t1 t2 1. 2. 3. 4. R J A (t)=r (t) * R J A R J A=S ee Datas heet T J M-T A = P DM* R J A (t) Duty C ycle, D=t1/t2
0.01 0.00001
0.0001
0.001
0.01
0.1
1
10
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Sep,04,2008
9
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STU411D
Ver 1.0
PACKAGE OUTLINE DIMENSIONS
E b2 L3 1 D1 E1 D H 1 L4 b1 e b 2 3 4 5 DETAIL "A" A C
TO-252-4L
L2 L L1 A1
DETAIL "A" INCHES MIN 0.087 0.000 0.017 0.025 0.205 0.018 0.236 0.205 0.252 0.173 0.050 0.370 0.055 0.108 0.020 0.035 0.025 0 7 MAX 0.094 0.005 0.027 0.031 0.215 0.023 0.245 0.217 0.265 0.197 BSC 0.409 0.070 REF. REF. 0.050 0.040 10 REF.
SYMBOLS A A1 b b1 b2 C D D1 E E1 e H L L1 L2 L3 L4 1
MILLIMETERS MIN 2.200 0.000 0.440 0.635 5.210 0.450 6.000 5.200 6.400 4.400 1.270 9.400 1.397 2.743 0.508 0.890 0.640 0 7 MAX 2.387 0.127 0.680 0.787 5.460 0.584 6.223 5.515 6.731 5.004 BSC 10.400 1.770 REF. REF. 1.270 1.010 10 REF.
Sep,04,2008
10
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STU411D
Ver 1.0
TO-252-4L Tape and Reel Data
TO-252-4L Carrier Tape
K0 T 6 Max B0 4 Max SECTION B-B A0 SECTION A-A
B
D1 P1 P2
E1 E2
UNIT: PACKAGE TO-252 (16 A0 6.96 0.1 B0 10.49 0.1 K0 2.79 0.1 D0 2 D1
1.5 + 0.1 -0
B
A
A
P0
D0
E
FEED DIRECTION
E 16.0 0.3
E1 1.75 0.1
E2 7.5 0.15
P0 8.0 0.1
P1 4.0 0.1
P2 2.0 0.15
T 0.3 0.05
TO-252-4L Reel
T S
V
R
M
N
G
H W
UNIT: TAPE SIZE 16 REEL SIZE 330 M 330 0.5 N 97 1.0 W
17.0 + 1.5 -0
T 2.2
H
13.0 + 0.5 - 0.2
K 10.6
S 2.0 0.5
G
R
K V
Sep,04,2008
11
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